EDA業(yè)內(nèi)矚目的年度活動(dòng)Cadence用戶大會(huì)CDNLive將于2012年8月9日于北京香格里拉酒店召開(kāi)，主辦方擬邀請(qǐng)400家客戶參加大會(huì)，本土最大分銷商科通集團(tuán)作為Cadence中國(guó)區(qū)最大增值代理商，將以贊助商名義參加大會(huì)，演示代理的Cadence PCB全線(Allegro和OrCAD)產(chǎn)品，幫助本土工程師利用高級(jí)EDA軟件加速產(chǎn)品設(shè)計(jì)。
科通集團(tuán)自2011年1月1日起正式與Cadence公司開(kāi)展分銷合作，科通集團(tuán)在中國(guó)區(qū)授權(quán)分銷Cadence的OrCAD 及Allegro全線產(chǎn)品。科通現(xiàn)已擁有包括Microsoft、Intel、Panasonic、Freescale 、Xilinx、SanDisk、Linear及Broadcom等在內(nèi)的多條產(chǎn)品線，在無(wú)線通信、電信設(shè)備、企業(yè)網(wǎng)絡(luò)、數(shù)字媒體、家庭娛樂(lè)、汽車電子、工業(yè)控制等領(lǐng)域擁有很高的市場(chǎng)份額。深圳、香港、北京、上海、南京、武漢、西安、成都、廈門(mén)等多個(gè)分公司及辦事處構(gòu)成了覆蓋全國(guó)的銷售和服務(wù)網(wǎng)絡(luò)，有超過(guò)500名高素質(zhì)員工為國(guó)內(nèi)的OEM廠商、ODM廠商和EMS廠商提供范圍廣泛的電子元器件銷售及方案提供服務(wù)。
Cadence用戶大會(huì)至今已經(jīng)舉辦7屆，每年的Cadence用戶大會(huì)關(guān)注EDA領(lǐng)域的年度熱點(diǎn)，以論文演講、技術(shù)演示、趨勢(shì)演講、產(chǎn)品演示的方式全面展示EDA領(lǐng)域的最新技術(shù)和方案，大會(huì)也提供了交流的平臺(tái)，方便與會(huì)者交流設(shè)計(jì)心得、解決設(shè)計(jì)難題。
2012年度Cadence用戶大會(huì)將于2012年8月9日在北京香格里拉酒店舉行。本次年會(huì)聚集了Cadence技術(shù)用戶、開(kāi)發(fā)商和業(yè)內(nèi)專家。與會(huì)者將從業(yè)內(nèi)同仁處了解應(yīng)對(duì)未來(lái)電子設(shè)計(jì)挑戰(zhàn)的新思路和解決方案。也可以通過(guò)論文演講與其他地區(qū)的半導(dǎo)體設(shè)計(jì)者分享重要設(shè)計(jì)與驗(yàn)證問(wèn)題的解決經(jīng)驗(yàn)，并為實(shí)現(xiàn)高級(jí)晶片、SoC和系統(tǒng)發(fā)現(xiàn)新技術(shù)。
本次年度大會(huì)為免費(fèi)活動(dòng)，歡迎業(yè)內(nèi)人士踴躍報(bào)名，在線注冊(cè)地址：
http://www.cadence.com/cn/cadence/events/Pages/registration.aspx?eventid=106
如有任何疑問(wèn)，請(qǐng)發(fā)送郵件至event_cn@cadence.com
會(huì)議日程安排：（2012年8月9日, 星期四）
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08:30-09:00 |
Registration and morning light breakfast |
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09:00-09:05 |
Opening Ceremony |
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James Liu, GM & VP sales, Cadence Design Systems |
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09:05-09:25 |
Keynote: Opportunities, Challenges, and Collaboration |
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Lip-Bu Tan, President and CEO, Cadence Design Systems |
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09:25-09:50 |
Keynote presentation |
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Dr. Wei Shaojun, Director, Institute of Microelectronics, Tsinghua University |
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09:50-10:15 |
Keynote: Realizing Best Performance, Power, Area, and Yield for the 2x Nanometer Era |
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Chi-Ping Hsu, Senior VP R&D, Cadence Design Systems |
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10:15-10:30 |
Morning Break |
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(Demo booth & Exhibition open) |
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10:30-11:55 |
Panel discussion (Theme: Aggregate or Disaggregate? Chinese semiconductor industry trend in the next 10 years) |
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Moderator: Charlie Huang, Senior VP, Worldwide Field Operations, Cadence Design Systems; 6 key executive panelists from China IC Ecosystem |
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11:55-12:00 |
Best Paper Award Ceremony |
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12:00-13:00 |
Lunch |
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(Demo booth open during 12:30-13:00) |
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Digital |
Custom/Analog |
System Design & Functional Verification |
IC Packaging and PCB Design |
Design & Verification IP |
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13:00-13:30 |
D-01 Encounter RTL-to-Signoff technology overview and roadmap --Cadence |
C-01 Custom Design And Simulation (CAS) Technology Overview --Cadence |
S-01 Functional Verification Overview --Cadence |
P-01 PCB and IC Packaging Technology Overview including Introduction of Sigrity Technology --Cadence |
I-01 Design & Verification IP technology overview --Cadence |
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13:30-14:00 |
D-02 Cadence Silicon Signoff and Verification Solutions Update--Cadence |
C-02 PVS: design and signoff with confidence--Cadence |
S-02 Next generation SoC co-development with Cadence’s System Development Suite--Cadence |
I-02 Reducing IC size, power and cost through early chip planning --Cadence |
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14:00-14:25 |
D-03 Customer Presentation --ARM |
C-03 Block and Chip level AMS Designer verification --NationalZ |
S-03 A comprehensive approach to scalable Framework for both vertical and horizontal reuse in UVM verification --AMD |
P-02 A new Methodology of Power Design and Analysis with Allegro PCB PDN --Ericsson |
I-03 customer presentation --ZTE |
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14:25-14:50 |
D-04 The implementation of Smartphone chip including Cortex TM-A5 core at Cadence Platform --Spreadtrum |
C-04 Using RelXpert to do performance degradation and lifetime simulation on mos device --Analogix |
S-04 Best Practice of Wreal Based Analog Modeling --LSI |
P-03 Building a PCB design quality assurance system —Huawei |
I-04 Customer presentation --Brite Semi |
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科通集團(tuán)是中國(guó)本土最大、成長(zhǎng)最快、關(guān)注增值服務(wù)的電子元器件及方案提供商，與全球主要的領(lǐng)先半導(dǎo)體供應(yīng)商緊密合作，例如Broadcom、Xilinx、Freescale、Linear、Atmel、Intel、Microsoft、Sandisk等等，致力于為國(guó)內(nèi)的OEM廠商、ODM廠商和EMS廠商提供范圍廣泛的電子元器件和技術(shù)支持服務(wù),應(yīng)用涉及智能手機(jī)、消費(fèi)電子、工控醫(yī)療、汽車及智能交通系統(tǒng)、網(wǎng)絡(luò)通信等眾多領(lǐng)域。歡迎聯(lián)絡(luò)科通集團(tuán)各地辦事處，總部電話：0755-26743210，如需了解更多信息，請(qǐng)?jiān)L問(wèn)科通集團(tuán)網(wǎng)站：www.comtech.com.cn，或關(guān)注科通官方微博：@comtech科通.