《電子技術(shù)應(yīng)用》
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芯片樣品驗(yàn)證平臺(tái)自適應(yīng)和同步測(cè)試功能的設(shè)計(jì)與實(shí)現(xiàn)
2023年電子技術(shù)應(yīng)用第2期
徐靖林,王棟,魏斌,王赟,竇志軍,成嵩
北京智芯微電子科技有限公司,北京 100192
摘要: 目前,芯片設(shè)計(jì)公司在對(duì)量產(chǎn)級(jí)的芯片進(jìn)行樣品驗(yàn)證時(shí),傳統(tǒng)的樣品驗(yàn)證方法大多是基于芯片自身特點(diǎn)來(lái)設(shè)計(jì)相應(yīng)的測(cè)試設(shè)備,然后通過(guò)測(cè)試夾具對(duì)芯片樣品逐一測(cè)試,不同的芯片會(huì)設(shè)計(jì)不同的測(cè)試設(shè)備。提出了一種自適應(yīng)且可同步測(cè)試的樣品驗(yàn)證平臺(tái)方案,既可以實(shí)現(xiàn)同時(shí)測(cè)試多顆芯片,也可以對(duì)不同接口的芯片進(jìn)行測(cè)試;既可以進(jìn)行可靠性實(shí)驗(yàn)測(cè)試,也可以進(jìn)行其他功能的測(cè)試,大大節(jié)省了測(cè)試設(shè)備的維護(hù)成本,提高測(cè)試效率。
中圖分類(lèi)號(hào):TN06
文獻(xiàn)標(biāo)志碼:A
DOI: 10.16157/j.issn.0258-7998.223053
中文引用格式: 徐靖林,王棟,魏斌,等. 芯片樣品驗(yàn)證平臺(tái)自適應(yīng)和同步測(cè)試功能的設(shè)計(jì)與實(shí)現(xiàn)[J]. 電子技術(shù)應(yīng)用,2023,49(2):55-60.
英文引用格式: Xu Jinglin,Wang Dong,Wei Bin,et al. Design and implementation of adaptive and synchronous test function of chip sample verification platform[J]. Application of Electronic Technique,2023,49(2):55-60.
Design and implementation of adaptive and synchronous test function of chip sample verification platform
Xu Jinglin,Wang Dong,Wei Bin,Wang Yun,Dou Zhijun,Cheng Song
Beijing Smart-Chip Microelectronics Technology Co., Ltd., Beijing 100192, China
Abstract: At present, in chip design companies, sample verification is carried out for mass production chips. Most of the traditional sample verification methods design corresponding test equipment based on the characteristics of the chip, and then test the chip samples one by one through the test fixture. Different chips will design different test equipment. In this paper, an adaptive and synchronous test sample verification platform scheme is proposed, which can not only test multiple chips at the same time, but also test chips with different interfaces. It can not only test the reliability experiment, but also test other functions, which greatly saves the maintenance cost of test equipment and improves the test efficiency.
Key words : adaptive;synchronous test;sample verification;test platform

0 引言

    隨著芯片行業(yè)的快速發(fā)展,在芯片設(shè)計(jì)公司,芯片測(cè)試貫穿于整個(gè)設(shè)計(jì)生產(chǎn)過(guò)程中,測(cè)試驗(yàn)證是芯片設(shè)計(jì)中非常重要的一部分。當(dāng)芯片量產(chǎn)回來(lái),首要的任務(wù)是對(duì)芯片所有的功能和性能進(jìn)行充分的測(cè)試驗(yàn)證,只有經(jīng)過(guò)全面驗(yàn)證達(dá)到預(yù)期的設(shè)計(jì)指標(biāo),才能推進(jìn)市場(chǎng)。而對(duì)于量產(chǎn)級(jí)的芯片,驗(yàn)證通常選取一定比例數(shù)量來(lái)進(jìn)行抽樣測(cè)試。

    目前,傳統(tǒng)的芯片樣品驗(yàn)證,在行業(yè)內(nèi)大多是基于自身芯片特征設(shè)計(jì)相應(yīng)的測(cè)試設(shè)備,通過(guò)測(cè)試夾具來(lái)逐一測(cè)試,針對(duì)不同的芯片需要設(shè)計(jì)不同的測(cè)試設(shè)備。圖1為傳統(tǒng)的芯片樣品驗(yàn)證單板測(cè)試電路結(jié)構(gòu)。單板測(cè)試對(duì)于樣品數(shù)量要求多、測(cè)試時(shí)間長(zhǎng)的測(cè)試項(xiàng)目來(lái)說(shuō),搭建環(huán)境、測(cè)試儀器設(shè)備的利用率以及時(shí)間配置完全不占優(yōu)勢(shì),大大降低了測(cè)試效率,導(dǎo)致項(xiàng)目周期延長(zhǎng)。




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作者信息:

徐靖林,王棟,魏斌,王赟,竇志軍,成嵩

(北京智芯微電子科技有限公司,北京  100192)




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