中圖分類號：TN454 文獻(xiàn)標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.245167
中文引用格式： 許文運(yùn)，張明，鄭利華. 基于先進(jìn)工藝技術(shù)的機(jī)電控制SiP電路的設(shè)計與測試[J]. 電子技術(shù)應(yīng)用，2024，50(11)：105-108.
英文引用格式： Xu Wenyun，Zhang Ming，Zheng Lihua. Design and test of SiP circuit of electromechanical control based on advanced technology[J]. Application of Electronic Technique，2024，50(11)：105-108.

Design and test of SiP circuit of electromechanical control based on advanced technology

Abstract： Electromechanical control system contains many kinds of chips, and its miniaturization and lightweight demand is increasingly urgent. As an advanced packaging method, system level packaging （System in Package）technology can integrate many different types of chips in a smaller space. In this paper, a SiP circuit of electromechanical control is designed based on system-level packaging technology, combined with TSV and FanOUT technology. The circuit includes the DSP signal control unit and the bottom FPGA signal processing unit, which are stacked in the form of PoP to form a SiP circuit. Compared with the electromechanical control system built by conventional discrete devices, the SiP volume is reduced by more than 70% and the weight is reduced by more than 80%. A test system is designed for SiP circuit, and a loopback test method is proposed for ADC and DAC chips, which can improve the test efficiency. The results show that the circuit meets the design requirements and has a certain application prospect in the field of electromechanical control.

Key words : electromechanical control；system level packaging；package on package；high integrate