摘要： 機(jī)電控制系統(tǒng)包含多款芯片，其小型化、輕量化的需求日益迫切，系統(tǒng)級(jí)封裝（System in Package）技術(shù)作為一種先進(jìn)封裝手段能夠?qū)⒍嗫畈煌?lèi)型的芯片集成于更小的空間中。基于系統(tǒng)級(jí)封裝技術(shù)，并結(jié)合TSV與FanOUT技術(shù)設(shè)計(jì)了一款機(jī)電控制SiP電路，該電路包括頂層DSP信號(hào)控制單元和底層FPGA信號(hào)處理單元，兩者通過(guò)PoP（Package on Package）形式堆疊構(gòu)成SiP電路，相比于常規(guī)分立器件所搭建的機(jī)電控制系統(tǒng)，該SiP體積縮小70%以上，重量減輕80%以上。針對(duì)該款SiP電路設(shè)計(jì)了相應(yīng)的測(cè)試系統(tǒng)，且對(duì)內(nèi)部的ADC及DAC等芯片提出了一種回環(huán)測(cè)試的方法，能夠提高測(cè)試效率。測(cè)試結(jié)果表明，該電路滿足設(shè)計(jì)要求，在機(jī)電控制領(lǐng)域具有一定的應(yīng)用前景。
中圖分類(lèi)號(hào)：TN454 文獻(xiàn)標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.245167 中文引用格式： 許文運(yùn)，張明，鄭利華. 基于先進(jìn)工藝技術(shù)的機(jī)電控制SiP電路的設(shè)計(jì)與測(cè)試[J]. 電子技術(shù)應(yīng)用，2024，50(11)：105-108. 英文引用格式： Xu Wenyun，Zhang Ming，Zheng Lihua. Design and test of SiP circuit of electromechanical control based on advanced technology[J]. Application of Electronic Technique，2024，50(11)：105-108.
Design and test of SiP circuit of electromechanical control based on advanced technology
Xu Wenyun，Zhang Ming，Zheng Lihua
No.58 Research Institute， China Electronics Technology Group Corporation
Abstract： Electromechanical control system contains many kinds of chips, and its miniaturization and lightweight demand is increasingly urgent. As an advanced packaging method, system level packaging （System in Package）technology can integrate many different types of chips in a smaller space. In this paper, a SiP circuit of electromechanical control is designed based on system-level packaging technology, combined with TSV and FanOUT technology. The circuit includes the DSP signal control unit and the bottom FPGA signal processing unit, which are stacked in the form of PoP to form a SiP circuit. Compared with the electromechanical control system built by conventional discrete devices, the SiP volume is reduced by more than 70% and the weight is reduced by more than 80%. A test system is designed for SiP circuit, and a loopback test method is proposed for ADC and DAC chips, which can improve the test efficiency. The results show that the circuit meets the design requirements and has a certain application prospect in the field of electromechanical control.
Key words : electromechanical control；system level packaging；package on package；high integrate
